Cypress Computer Hardware CY7C1012DV33 User Manual

CY7C1012DV33  
12-Mbit (512K X 24) Static RAM  
Features  
Functional Description  
High speed  
tAA = 10 ns  
Low active power  
ICC = 175 mA at 10 ns  
Low CMOS standby power  
ISB2 = 25 mA  
The CY7C1012DV33 is a high performance CMOS static RAM  
organized as 512K words by 24 bits. Each data byte is separately  
controlled by the individual chip selects (CE1, CE2, and CE3).  
CE1 controls the data on the I/O0 – I/O7, while CE2 controls the  
data on I/O8 – I/O15, and CE3 controls the data on the data pins  
I/O16 – I/O23. This device has an automatic power down feature  
that significantly reduces power consumption when deselected.  
Writing the data bytes into the SRAM is accomplished when the  
chip select controlling that byte is LOW and the write enable input  
(WE) input is LOW. Data on the respective input and output (I/O)  
pins is then written into the location specified on the address pins  
(A0 – A18). Asserting all of the chip selects LOW and write enable  
LOW writes all 24 bits of data into the SRAM. Output enable (OE)  
is ignored while in WRITE mode.  
Operating voltages of 3.3 ± 0.3V  
2.0V data retention  
Automatic power down when deselected  
TTL compatible inputs and outputs  
Available in Pb-free standard 119-ball PBGA  
Data bytes are also individually read from the device. Reading a  
byte is accomplished when the chip select controlling that byte  
is LOW and write enable (WE) HIGH, while output enable (OE)  
remains LOW. Under these conditions, the contents of the  
memory location specified on the address pins appear on the  
specified data input and output (I/O) pins. Asserting all the chip  
selects LOW reads all 24 bits of data from the SRAM.  
The 24 I/O pins (I/O0 – I/O23) are placed in a high impedance  
state when all the chip selects are HIGH or when the output  
enable (OE) is HIGH during a READ mode. For more infor-  
Logic Block Diagram  
INPUT BUFFER  
I/O0 – I/O7  
I/O8 – I/O15  
I/O16 – I/O23  
512K x 24  
ARRAY  
A(9:0)  
CE1, CE2, CE3  
COLUMN  
DECODER  
WE  
CONTROL LOGIC  
OE  
A(18:10)  
Cypress Semiconductor Corporation  
Document Number: 38-05610 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 6, 2008  
 
CY7C1012DV33  
Current into Outputs (LOW) ........................................ 20 mA  
Static Discharge Voltage............. ...............................>2001V  
(MIL-STD-883, Method 3015)  
Maximum Ratings  
Exceeding maximum ratings may impair the useful life of the  
device. These user guidelines are not tested.  
Storage Temperature ................................. –65°C to +150°C  
Latch Up Current..................................................... >200 mA  
Ambient Temperature with  
Power Applied ............................................ –55°C to +125°C  
Operating Range  
Supply Voltage on VCC Relative to GND [2]....–0.5V to +4.6V  
Ambient  
Range  
VCC  
Temperature  
DC Voltage Applied to Outputs  
in High-Z State [2] .................................. –0.5V to VCC + 0.5V  
Industrial  
–40°C to +85°C  
3.3V ± 0.3V  
DC Input Voltage [2] ............................... –0.5V to VCC + 0.5V  
DC Electrical Characteristics Over the Operating Range  
–10  
Parameter  
Description  
Test Conditions [3]  
Unit  
Min  
Max  
VOH  
VOL  
VIH  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
VCC = Min, IOH = –4.0 mA  
VCC = Min, IOL = 8.0 mA  
2.4  
V
V
0.4  
VCC + 0.3  
0.8  
2.0  
–0.3  
–1  
V
[2]  
VIL  
V
IIX  
Input Leakage Current  
Output Leakage Current  
GND < VI < VCC  
+1  
μA  
μA  
mA  
IOZ  
ICC  
GND < VOUT < VCC, output disabled  
–1  
+1  
VCC Operating Supply  
Current  
VCC = Max, f = fMAX = 1/tRC  
IOUT = 0 mA CMOS levels  
175  
ISB1  
ISB2  
Automatic CE Power Down Max VCC, CE > VIH  
30  
25  
mA  
mA  
Current —TTL Inputs  
VIN > VIH or VIN < VIL, f = fMAX  
Automatic CE Power Down Max VCC, CE > VCC – 0.3V,  
Current —CMOS Inputs  
VIN > VCC – 0.3V, or VIN < 0.3V, f = 0  
Notes  
2.  
V
(min) = –2.0V and V (max) = V + 2V for pulse durations of less than 20 ns.  
IL IH CC  
3. CE indicates a combination of all three chip enables. When active LOW, CE indicates the CE or CE or CE is LOW. When HIGH, CE indicates the CE CE and  
1
2 ,  
3
1 ,  
2 ,  
CE are HIGH.  
3
Document Number: 38-05610 Rev. *D  
Page 3 of 11  
 
   
CY7C1012DV33  
Capacitance  
Tested initially and after any design or process changes that may affect these parameters.  
Parameter  
CIN  
Description  
Input Capacitance  
I/O Capacitance  
Test Conditions  
Max  
8
Unit  
pF  
TA = 25°C, f = 1 MHz, VCC = 3.3V  
COUT  
10  
pF  
Thermal Resistance  
Tested initially and after any design or process changes that may affect these parameters.  
119-Ball  
PBGA  
Parameter  
Description  
Test Conditions  
Unit  
ΘJA  
Thermal Resistance  
(junction to ambient)  
Still air, soldered on a 3 × 4.5 inch,  
four layer printed circuit board  
20.31  
°C/W  
ΘJC  
Thermal Resistance  
(junction to case)  
8.35  
°C/W  
Figure 2. AC Test Loads and Waveforms[4]  
50Ω  
30 pF*  
R1 317 Ω  
3.3V  
= 1.5V  
VTH  
OUTPUT  
OUTPUT  
Z = 50Ω  
0
R2  
351Ω  
5 pF*  
*Including jig  
and scope  
(a)  
(b)  
*Capacitive Load consists of all  
components of the test environment  
All input pulses  
3.0V  
90%  
10%  
90%  
10%  
GND  
Rise Time > 1V/ns  
Fall Time:> 1V/ns  
(c)  
Note  
4. Valid SRAM operation does not occur until the power supplies have reached the minimum operating V (3.0V). 100μs (t  
) after reaching the minimum operating  
power  
DD  
V
, normal SRAM operation begins including reduction in V to the data retention (V  
, 2.0V) voltage.  
CCDR  
DD  
DD  
Document Number: 38-05610 Rev. *D  
Page 4 of 11  
 
   
CY7C1012DV33  
AC Switching Characteristics  
[5]  
Over the Operating Range  
–10  
Parameter  
Description  
Unit  
Min  
Max  
Read Cycle  
[6]  
tpower  
tRC  
VCC(Typical) to the First Access  
100  
10  
μs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Read Cycle Time  
tAA  
Address to Data Valid  
10  
tOHA  
tACE  
Data Hold from Address Change  
CE Active LOW to Data Valid [3]  
OE LOW to Data Valid  
OE LOW to Low Z [7]  
OE HIGH to High Z [7]  
CE Active LOW to Low Z [3, 7]  
CE Deselect HIGH to High Z [3, 7]  
CE Active LOW to Power Up [3, 8]  
CE Deselect HIGH to Power Down [3, 8]  
3
10  
5
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tPU  
1
3
0
5
5
tPD  
10  
Write Cycle [9, 10]  
tWC  
Write Cycle Time  
10  
7
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSCE  
CE Active LOW to Write End [3]  
Address Setup to Write End  
Address Hold from Write End  
Address Setup to Write Start  
WE Pulse Width  
tAW  
7
tHA  
0
tSA  
0
tPWE  
tSD  
7
Data Setup to Write End  
Data Hold from Write End  
WE HIGH to Low Z [7]  
5.5  
0
tHD  
tLZWE  
tHZWE  
3
WE LOW to High Z [7]  
5
Notes  
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, and input pulse levels of 0 to 3.0V. Test conditions for the read cycle use  
output loading as shown in part a) of Figure 2, unless specified otherwise.  
6.  
7.  
t
t
gives the minimum amount of time that the power supply is at typical V values until the first memory access is performed.  
CC  
POWER  
, t  
, t  
, t  
, t  
, and t  
are specified with a load capacitance of 5 pF as in part (b) of Figure 2. Transition is measured ±200 mV from steady state  
HZOE HZCE HZWE LZOE LZCE  
LZWE  
voltage.  
8. These parameters are guaranteed by design and are not tested.  
9. The internal write time of the memory is defined by the overlap of CE or CE or CE LOW and WE LOW. Chip enables must be active and WE must be LOW to initiate  
1
2
3
a write. The transition of any of these signals terminate the write. The input data setup and hold timing are referenced to the leading edge of the signal that terminates  
the write.  
10. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of t  
and t  
.
HZWE  
SD  
Document Number: 38-05610 Rev. *D  
Page 5 of 11  
 
           
CY7C1012DV33  
Data Retention Characteristics  
Over the Operating Range  
Parameter  
VDR  
Description  
VCC for Data Retention  
Data Retention Current  
Conditions [3]  
Min  
Typ  
Max  
Unit  
V
2
ICCDR  
VCC = 2V, CE > VCC – 0.2V,  
VIN > VCC – 0.2V or VIN < 0.2V  
25  
mA  
[11]  
tCDR  
Chip Deselect to Data Retention  
Time  
0
ns  
ns  
[12]  
tR  
Operation Recovery Time  
tRC  
Data Retention Waveform  
DATA RETENTION MODE  
3.0V  
3.0V  
VCC  
CE  
V
DR  
>
2V  
t
t
R
CDR  
Switching Waveforms  
Figure 3. Read Cycle No. 1 [13, 14]  
tRC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Figure 4. Read Cycle No. 2 (OE Controlled) [3, 14, 15]  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
VCC  
SUPPLY  
CURRENT  
DATA VALID  
t
LZCE  
t
PD  
ICC  
ISB  
t
PU  
50%  
50%  
Notes  
11. Tested initially and after any design or process changes that may affect these parameters.  
12. Full device operation requires linear V ramp from V to V > 50 μs or stable at V > 50 μs.  
CC(min)  
CC  
DR  
CC(min)  
13. Device is continuously selected. OE, CE = V .  
IL  
14. WE is HIGH for read cycle.  
15. Address valid before or similar to CE transition LOW.  
Document Number: 38-05610 Rev. *D  
Page 6 of 11  
 
         
CY7C1012DV33  
Switching Waveforms (continued)  
Figure 5. Write Cycle No. 1 (CE Controlled) [3, 16, 17]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
SCE  
t
t
HA  
AW  
t
PWE  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
Figure 6. Write Cycle No. 2 (WE Controlled, OE HIGH During Write) [3, 16, 17]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
OE  
t
t
SD  
t
HD  
HZOE  
DATA VALID  
DATA I/O  
IN  
NOTE 18  
Figure 7. Write Cycle No. 3 (WE Controlled, OE LOW) [3, 17]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
NOTE 18  
DATA I/O  
DATA VALID  
t
t
LZWE  
HZWE  
Notes  
16. Data I/O is high impedance if OE = V  
.
IH  
17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state.  
18. During this period, the I/Os are in output state. Do not apply input signals.  
Document Number: 38-05610 Rev. *D  
Page 7 of 11  
 
     
CY7C1012DV33  
Truth Table  
CE1  
H
L
CE2  
H
H
L
CE3  
H
H
H
L
OE  
X
L
WE  
X
I/O0 – I/O7  
High Z  
I/O8 – I/O15  
High Z  
I/O16 – I/O23  
High Z  
Mode  
Power  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Power Down  
Read  
)
H
H
H
H
L
Data Out  
High Z  
High Z  
High Z  
)
H
H
L
L
Data Out  
High Z  
High Z  
Read  
)
H
L
L
High Z  
Data Out  
Read  
)
L
L
Full Data Out Full Data Out Full Data Out Read  
)
L
H
L
H
H
L
X
X
X
X
H
Data In  
High Z  
High Z  
High Z  
Write  
Write  
Write  
Write  
)
H
H
L
L
Data In  
High Z  
High Z  
)
H
L
L
High Z  
Data In  
Full Data In  
High Z  
)
L
L
Full Data In  
High Z  
Full Data In  
High Z  
)
L
L
L
H
Selected,  
)
Outputs Disabled  
Document Number: 38-05610 Rev. *D  
Page 8 of 11  
 
 
CY7C1012DV33  
Ordering Information  
Speed  
Package  
Name  
Operating  
Range  
Ordering Code  
(ns)  
Package Type  
10  
CY7C1012DV33-10BGXI  
51-85115 119-Ball Plastic Ball Grid Array (14 x 22 x 2.4 mm) (Pb-Free)  
Industrial  
Package Diagram  
Figure 8. 119-Ball PBGA (14 x 22 x 2.4 mm)  
51-85115-*B  
Document Number: 38-05610 Rev. *D  
Page 9 of 11  
 
CY7C1012DV33  
Document History Page  
Document Title: CY7C1012DV33 12-Mbit (512K X 24) Static RAM  
Document Number: 38-05610  
Orig. of  
Change  
Submission  
Date  
Rev. ECN No.  
Description of Change  
**  
250650  
469517  
SYT  
NXR  
See ECN New data sheet  
*A  
See ECN Converted from Advance Information to Preliminary  
Corrected typo in the Document Title  
Removed –10 and –12 speed bins from product offering  
Changed J7 Ball of BGA from DNU to NC  
Removed Industrial Operating range from product offering  
Included the Maximum ratings for Static Discharge Voltage and Latch Up Current  
on page 3  
Changed ICC(Max) from 220 mA to 150 mA  
Changed ISB1(Max) from 70 mA to 30 mA  
Changed ISB2(Max) from 40 mA to 25 mA  
Specified the Overshoot specification in footnote 1  
Updated the Truth Table  
Updated the Ordering Information table  
*B  
499604  
NXR  
VKN  
See ECN Added note 1 for NC pins  
Changed ICC specification from 150 mA to 185 mA  
Updated Test Condition for ICC in DC Electrical Characteristics table  
Added note for tACE, tLZCE, tHZCE, tPU, tPD, and tSCE in AC Switching Characteristics  
Table on page 4  
*C  
*D  
1462585  
See ECN Converted from preliminary to final  
Updated block diagram  
Changed ICC specification from 185 mA to 225 mA  
Updated thermal specs  
2604677 VKN/PYRS  
11/12/08  
Removed Commercial operating range, Added Industrial operating range  
Removed 8 ns speed bin, Added 10 ns speed bin,  
Modified footnote# 3  
Document Number: 38-05610 Rev. *D  
Page 10 of 11  
 
CY7C1012DV33  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at cypress.com/sales.  
Products  
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© Cypress Semiconductor Corporation, 2004-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used  
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use  
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support  
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
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the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 38-05610 Rev. *D  
Revised November 6, 2008  
Page 11 of 11  
All product and company names mentioned in this document are the trademarks of their respective holders.  
 

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